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New MOB10 contactless chip module transforms how passports and identity cards are designed while adding more security.
October 18, 2017
By: DAVID SAVASTANO
Editor, Ink World Magazine
NXP Semiconductors N.V. announced its new, ultra-thin contactless chip module that transforms how passport and identity cards are designed. Measuring just 200 μm thick – roughly four times the thickness of an average human hair – the MOB10 is 20% thinner than its predecessor and is suited for use in ultra-thin inlays for passport data pages and identity cards. The MOB10 is the thinnest contactless module available in high volumes today and supports polycarbonate technology, along with new s...
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